ECOOP 2018
Sun 15 - Sat 21 July 2018 Amsterdam, Netherlands
co-located with ECOOP and ISSTA
Mon 16 Jul 2018 17:00 - 17:20 at Zurich II - Machine Learning Chair(s): Alex Orso

Deep learning applications become increasingly popular in important domains such as self-driving systems and facial identity systems. Defective deep learning applications may lead to catastrophic consequences. Although recent research efforts were made on testing and debugging deep learning applications, the characteristics of deep learning defects have never been studied. To fill this gap, we studied deep learning application bugs collected from StackOverflow QA pages and Github projects. We extracted information from QA pages, commit messages, pull request messages, and issue discussions to examine the root causes and symptoms of these bugs. We also studied the strategies deployed by developers for bug detection and localization. These findings help researchers and developers to gain a better understanding of deep learning defects and point out new direction for future research.

Mon 16 Jul

issta-2018-Technical-Papers
16:00 - 17:30: ISSTA Technical Papers - Machine Learning at Zurich II
Chair(s): Alex OrsoGeorgia Institute of Technology
issta-2018-Technical-Papers16:00 - 16:20
Talk
Chris CumminsUniversity of Edinburgh, Pavlos PetoumenosUniversity of Edinburgh, Alastair MurrayCodeplay Software, Hugh LeatherUniversity of Edinburgh
issta-2018-Technical-Papers16:20 - 16:40
Talk
Tien-Duy B. LeSchool of Information Systems, Singapore Management University, David LoSingapore Management University
issta-2018-Technical-Papers16:40 - 17:00
Talk
Anurag DwarakanathAccenture Labs, Manish AhujaAccenture Labs, Samarth SikandAccenture Labs, Raghotham M RaoAccenture Labs, R.P. Jagadeesh Chandra BoseAccenture Labs, Neville DubashAccenture Labs, Sanjay Podder
issta-2018-Technical-Papers17:00 - 17:20
Talk
Yuhao ZhangPeking University, Yifan ChenPeking University, Shing-Chi CheungDepartment of Computer Science and Engineering, The Hong Kong University of Science and Technology, Yingfei XiongPeking University, Lu ZhangPeking University
Pre-print
issta-2018-Technical-Papers17:20 - 17:30